By Jan Koum Center for Nanoscience and Nanotechnology, Tel Aviv University
Dry Etching (RIE). High-density plasma for etching metals (e.g., Al, Ti, Au), metal oxides, and semiconductor compounds. Supports corrosive plasma chemistries, stable etch rates, excellent uniformity, deep substrate etch (DSE) capabilities. Uses halogen-based plasmas for selective chemical dry etching.
