As part of a full turnkey offering, we offer bump, wafer level package and probe capabilities, complemented by OSAT partnerships, to provide a one-stop-shop for customers’ wafer needs. Creating a reliable and high-quality path to production, we streamline manufacturing so customers can realize their designs quicker. - Bump offerings for 200mm and 300mm, including SnAg bump, copper pillar and WLCSP - Wafer sort with Known Good Die methodology - Backside grind, wafer sort and bake, dicing, marking and binning services available
