By DB HiTek
JCET Group is a global leader in integrated circuit back-end manufacturing and technology services. We provide comprehensive turnkey solutions, including semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipments. Utilizing advanced wafer-level packaging, 2.5D/3D packaging, System-in-Package solutions, and reliable flip chip and wire bonding technologies, we support a wide range of applications, including automotive, artificial intelligence, high-performance computing, storage, communication, smart devices, industrial and medical sectors, and power and energy. With cutting-edge R&D centers in China and Korea, and manufacturing facilities across China, Korea, and Singapore, we deliver efficient supply chain solutions and maintain close collaboration with our global customers. Factories & Branches and Supported Technologies: JCET Jiangyin: QFN/DFN, BGA, QFP, SOP/SOT/TO, Power Module, Flip Chip, SiP, testing JCET STATS ChipPAC China (Jiangyin): QFN / DFN, BGA, QFP, SOP/SOT/TO, Flip Chip, SiP, testing JCET Advanced Packaging (Jiangyin): FI / FO WLP, Bumping, testing JCET Microelectronics: Flip Chip, FI / FO WLP, 2.5D / 3D, testing JCET Suqian: QFN/DFN, SOP/SOT/TO, Power Module, testing JCET Chuzhou: QFN/DFN, HFBP, SOP/SOT/TO, Flip Chip, testing STATS ChipPAC Korea: BGA, Power Module, Flip Chip, SiP, Bumping, 2.5D / 3D, testing JCET STATS ChipPAC Korea: BGA, Power Module, Flip Chip, SiP, Bumping, 2.5D / 3D, testing STATS ChipPAC Singapore: QFN/DFN, Flip Chip, FI / FO WLP, Bumping, testing JCET Automotive Electronics: QFN/DFN, BGA, QFP, Power Module, Flip Chip, SiP, testing SanDisk Semiconductor Shanghai: BGA, Flip Chip, SiP, testing
