Rogue Valley Microdevices provides photoresist coating services for MEMS photolithography, including both spin coat and spray coat processes on 100mm, 150mm, and 200mm wafers. As a U.S.-based, ITAR-registered MEMS foundry, we coat, expose, and develop in the same fab that builds complete MEMS devices. Resist coating determines how faithfully every downstream pattern prints. Our engineers help you select the resist system and coating method that match your device materials, etch chemistries, and pattern requirements, so photolithography succeeds on the first pass instead of the third. Whether your wafers are flat and film-covered or carry deep, previously etched MEMS features, we have a coating process that fits your device architecture and fabrication flow. Photoresist Materials and Coating Capabilities Successful lithography starts with matching the resist chemistry to your downstream etch selectivity and device geometry. We support a range of photoresist systems for flat and high-topography substrates: Positive photoresist - Spin coat - 1.5µm to 3.5µm - Planar pattern transfer - Standard MEMS photolithography Lift-off resist (LOR) - Spin coat - Scaled to metal thickness - Bilayer stack pattern definition - Clean noble-metal patterning without chemical etching Thick photoresist - Spin or spray coat - Up to 10µm spin; 20µm to 25µm spray - Deep masking over vertical features - DRIE soft masks and deep etch masking SU8 permanent resist - Spin coat - Per application - Chemically stable, permanent structural polymer - Microfluidic channels and bioMEMS devices Polyimide - Spin coat - Per application - Permanent dielectric and stress buffer - Stress-buffer and passivation layers in device stacks These resist systems also serve as the soft masks for our co-located dry etch and wet etch lines, and the bilayer stacks behind our metal lift-off process, so every coating is tuned against the etch or lift-off step it will face. Supported Wafer Sizes and Materials We coat 100mm, 150mm, and 200mm wafers across a broad set of substrate materials: Silicon Silicon on insulator (SOI) Quartz Sapphire Glass GaN on silicon Silicon carbide Other specialty substrates One Fab from Resist Coating to Finished Device By combining spray coat and spin coat photoresist with precision mask alignment and wafer photolithography services, Rogue Valley Microdevices enables reliable patterning across complex MEMS device architectures. Because every step happens under one roof, you get one engineering team, full transparency into process decisions, and no hand-offs between vendors. Request Photoresist Coating Services Send us your substrate, topography, and resist requirements. Our engineers will recommend the right coating method for your device and follow up with a clear, practical quote.
