Wet chemical etching also enables selective removal of metal thin films used in microelectronic and MEMS structures. Our process capability supports metal etchants for PVD-deposited materials such as gold (Au), chromium (Cr), and aluminum (Al), defining conductive pathways, electrodes, and bonding pads on silicon wafers. For metals that resist chemical etchants, such as platinum, our metal lift-off process provides an additive alternative.
