By Atomica
Atomica has the cutting-edge tools, sophisticated manufacturing processes, and expertise to create high-quality TSVs, microscopic MEMS, and advanced integrated packages. With deep experience in material science, Atomica offers a wide array of plating materials, including copper (Cu), gold (Au), silver (Ag), indium (In), nickel (Ni), tin (Sn), and alloys such as iron-nickel (NiFe) and gold-tin (AuSn). Atomica’s outstanding capabilities in bonding techniques, including thermal compression, fusion, direct bonding, polymer bonding, and hybrid bonding, enable unique solutions like bonding stacks of four silicon wafers.
