Dresden, 9 October 2026. GlobalFoundries today (Oct. 9) unveiled FDX Fusion in Dresden, a new generation of its fully depleted silicon-on-insulator (FD-SOI) technology aimed at physical AI. The first generation is expected to offer 7-nm-class digital performance and more than twice the density of GlobalFoundries' first-generation FDX technology.
Manfred Horstmann, senior VP and general manager of European fabs at GlobalFoundries, said the company expects to invest roughly $1 billion over the coming years in FDX Fusion development, including about $250 million for the initial capability toolset. Demonstrator silicon is targeted for early 2027, with an initial process design kit planned for mid-2027.
FDX Fusion will combine RF, analog, mixed-signal, embedded nonvolatile memory, in-memory computing, and dense logic capabilities. Horstmann said the platform should reach logic densities of roughly 14 million to 18 million gates per square millimeter.
GlobalFoundries is developing the strained-silicon substrate with CEA-Leti and Soitec through a European project Horstmann identified as "Fast and FAMES." The partners have built a pilot line in France for the substrate, which uses a strained 70-angstrom silicon film intended to increase electron mobility by about 25%.
The announcement came as GlobalFoundries celebrated the topping-off of SPRINT, its Dresden fab expansion supported under the European Chips Act. The project is adding cleanroom, laboratory, and manufacturing capacity at the site.
Source: EE Times
HORIBA STEC KOREA will produce the D500 series mass flow controller in Korea, with mass production slated from June 2021 and a target of 1,000 units per month by the end of 2021.
Allwin21 provides upgrade kits for Branson/IPC L3200 plasma systems, replacing obsolete controllers, electronics and control modules while preserving the original process platform.
Zeiss SMT announced its entry into wafer inspection systems at SEMICON West 2026, showcasing the Zeiss DUNE and Zeiss NLX products.
