ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced that an industry-leading provider of non-volatile magnetoresistive random-access memory (MRAM) devices has ordered its first Solstice S8 single-wafer wet processing system. The customer selected the Solstice system for its ability to deliver repeatable wet processing essential to meeting high-volume manufacturing (HVM) requirements. The Solstice S8 system configuration will include three Gen4 ECD reactors and three bevel etch chambers to perform electroplating for copper damascene processes. Used to create copper interconnects in chip fabrication, copper damascene offers significant benefits for MRAM manufacturing, primarily due to its superior electrical conductivity and reliability in building the interconnect layers. The damascene process allows for precise patterning of copper, which minimizes resistive losses and improves the overall speed and efficiency of MRAM devices. This is crucial for MRAM applications, which rely on fast and efficient data writing and retrieval. ClassOne Technology CEO Byron Exarcos said, "The Solstice S8 delivers proven plating performance and reliability in copper damascene that the customer's existing wafer-processing equipment cannot accommodate at the high levels of performance required." Its advanced IP portfolio comprises highly customized, cost-effective processing solutions for critical wafer processes used to manufacture devices for photonics, power, 5G, microLED, and MEMS and sensor markets. With tools installed in leading fabs and research organizations worldwide, ClassOne's flagship Solstice platform is highly configurable, comprising fully and semi-automated electroplating and wet processing applications with the industry's most competitive ROI.
The Solstice single-wafer platform can combine multiple process technologies and chemistries in a single, small-footprint configuration for advanced chip packaging applications. VTT’s Solstice S8 system chambers will include Vacuum Prewet for high-aspect-ratio features; CopperMax™ and Copper Gen4 ECD for plating; and spin-rinse-dry (SRD) for clean, fast wafer drying post-plating. The Solstice platform’s flexible operation combines automation with manual operation, making the tool attractive for both R&D and pilot-line use, both of which VTT will use the tool to pursue. This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer processing system from ClassOne Technology.
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advanced single-wafer wet processing systems Configured with ClassOne's GoldPro™ electroplating chambers, the Solstice systems will be used for high-volume gold electroplating of 4-inch and 6-inch indium phosphide (InP) wafers key to next-generation optical devices for artificial intelligence (AI) data centers and other high-bandwidth communications applications. The Solstice systems deliver advanced gold plating performance to provide the throughput and process consistency required for volume InP manufacturing. These customers value the Solstice system's flexibility, which allows for metal lift-off, wet-etch and other processes to be added on the same platform. ClassOne's flagship Solstice platform is highly configurable, comprising fully automated wet processing applications with the industry's most competitive ROI.
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Solstice ® Metal Lift-Off™ Chamber Key Applications - Multi-Metal Stack Pillar Plating - Metal Lift-Off - Photoresist Strip Process Our Solstice ® metal lift-off (MLO) and solvent strip chamber is a highly capable single-wafer automated solvent chamber. The chambers contain both a high-flow, low-pressure spray for ‘soaking’ applications as well as a high-pressure, programmable swing arm for more aggressive lift-off. This chamber is also capable of polymer removal. Fresh and reclaim solvent tanks, and inline heaters, provide fast and efficient solvation and stripping of organic films from the wafer. Our Solstice MLO process has been demonstrated on features below 1 micron in width. For safety, the face-down architecture of the solvent and MLO chamber prevents operator exposure to aggressive solvents unlike open chamber solvent systems. The chamber’s annular exhaust allows for high-volume, low-velocity exhaust pull, minimizing chemistry loss during operation during operation. An integrated fire suppression system and safety system also assures you the tool meets or exceeds all life-safety standards. Before Metal Lift-Off After Metal Lift-Off Solstice® Metal Lift-Off Chamber with Face-Up SRD Chamber Overview Solstice Solvent Processing / MLO Explainer video
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ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has shipped another Solstice®CopperMax™ single-wafer processing system to a leading provider of aerospace and defense solutions. Built on ClassOne’s state-of-the-art, high-throughput Solstice platform, the system will augment the customer’s existing installed base of multiple ClassOne tools. The Solstice S8 system features the company’s proprietary CopperMax reactor, designed to deliver high-performance copper plating at a low cost of ownership. The flexible Solstice platform can perform a broad range of electroplating and surface preparation applications on a single, compact system.
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