NW
Packaging & AssemblyFabrication & Surface Engineering

SCALE™ optical module solution (silicon photonics Co-packaged Advanced Light Engine)

By GLOBALFOUNDRIES

AI-scale systems need optical connectivity that can move closer to the compute engine while reducing power, latency and system complexity. Our SCALE™ optical module solution, or silicon photonics Co-packaged Advanced Light Engine solution, is designed to support this transition, integrating advanced silicon photonics with high-speed electrical ICs and scalable packaging architectures. Built for modern AI systems, our SCALE CPO solution supports both CWDM and DWDM transmission, delivering efficient, high-bandwidth connectivity across next-generation optical interconnects.