NW
Mechanical & Physical TestingCharacterization & Testing

Metrology and Process Control

By Rogue Valley Microdevices

Every deposition and etch step is backed by in-house metrology. We verify film thickness and uniformity against documented tolerances, characterize film stress with monitor wafers from run to run, and measure critical dimensions after lithography and etch. Results are recorded on process travelers, giving you a complete, traceable record of how your wafers were built.