The development involves a piezoresistive, micro-mechanically fabricated MEMS technology platform with a minimizable zero-signal offset. The platform is highly scalable and well suited for applications such as micro-force measurement or high-precision differential-pressure determination. By optimizing the technology and employing a robust chip design in combination with on-chip compensation structures, the offset and its sensitivity to temperature (TCO) and mechanical stress can be reduced already at the wafer and chip levels. One way to make use of the compensation structures is to selectively turn on or off small resistors in a variety of configurations via a stud-bumping process. Moreover, the platform is scalable in terms of on-chip compensation and self-testing thanks to additional integrated components —such as micromachined fuses and micro-heaters. When deployed as a differential-pressure transducer in the low-to-mid-pressure range (demonstrator), the platform achieves sensitivities exceeding 2 mV / V / kPa. DEMONSTRATOR: DIFFERENTIAL PRESSURE SENSOR FOR LOW PRESSURE RANGES (< 30 mbar). PARAMETER Value: Chip size 7 x 7 mm²; Null-Signal-Offset < 1mV/V; TCO Max. 6μV/V/ °C.
