In such situations, unconventional wire bonding techniques can be a good alternative. Modern bonding systems can achieve the required high density of connections—even if these are arranged in multiple rows or as a dense array. In combination with a suitable test circuit board, the electrical connection for testing the chips can thus be established without relying on expensive multilayer circuit boards or application-specific interposers. For particularly time-critical developments, the wire bonding process can be trained in parallel with IC manufacturing using test structures.
