By Shanghai Huali Microelectronics Corporation (HLMC)
With an area of 1,200 m2, HLMC's failure analysis laboratory is equipped with the world-leading physical and electrical analysis devices. It can provide the customers with failure location, failure mode diagnostics, mechanism analysis, process diagnostics, device structure and materials characterization and other comprehensive chip-level and package-level failure analysis services to assist the customers in improving the design of products and processes, reducing R&D cycle of processes, and improving the yield and reliability of products. Main analysis instrument: - Spherical aberration-corrected transmission electron microscopy (TEM) - Ultra-low voltage scanning electron microscopy (SEM) - High-performance focused ion beam microscopy (FIB) - Quad secondary ion mass spectrometer (Quad SIMS) - Backside photon emission microscopy (PEM), phase-locking thermal emission microscopy (Thermal Emission)/nano-probing analysis system (Nano-Prober)
