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Logic Process Technology Platforms

By Shanghai Huali Microelectronics Corporation (HLMC)

HLMC has been synchronously developing logic process technologies and specialty process technologies. On the part of logic process technologies, HLMC has been following Moore’s Law and established 65/55nm, 40nm and 28/22nm logic technology platforms with independent intellectual property rights. HLMC has developed a series of 65/55nm logic and specialty process technologies including 55nm LP, 55nm RF, 55nm CMOS image sensor, 55nm HV, 55nm ULP, 55nm eFlash and 65/55/50nm NOR Flash. These technologies are all available for volume production. HLMC has also achieved volume production for different types of chips by using 40nm LP and 40nm RF, and 40nm eFlash technology platforms. HLMC has successfully achieved volume production of 28nm LP, 28nm RF and 28nm HKC+ technologies. HLMC is expanding its 28nm technology capability and plans to offer 28nm HV, 28nm CMOS image sensor, 28nm eFlash and etc..Meanwhile,HLMC has started small volume production of 22nm logic process.