Mechanical cross-sections for when you need to see a larger area than a FIB cut allows: electronic packages, solder joints, coatings, and layered parts, imaged by SEM with EDS on request. Typical questions - What does the whole joint, package, or layer stack look like in section? - Are there voids, cracks, or delamination across the part? - How do layer thicknesses vary across a larger area? Good to know - EDS maps across the section are available on request.
