By ATLANT 3D
First ever on-demand atomic layer advanced manufacturing technology based on hybrid Direct Atomic Layer Processing. We developed DALP® (Direct Atomic Layer Processing) patent-pending technology that provides highly conformal, direct material writing, and removal with atomic precision and material versatility. It is suitable for a wide range of applications such as MEMS, devices, optics, photonics, packaging, RF & electronics and quantum devices which can be developed with ATLANT 3D technology with previously impossible functionality and speed at a fraction of a cost. ATLANT 3D’s Direct Atomic Layer Processing (DALP®) has revolutionized prototyping, turning a traditionally lengthy process into a rapid, precise operation. Key benefits include accelerated development cycles, atomic-level control for complex prototypes, versatile material and surface adaptability, and cost reductions due to increased efficiency. This advancement in DALP® fosters a conducive environment for innovative microdevice fabrication, marking a significant leap in microfabrication technology. ATLANT 3D’s Direct Atomic Layer Processing (DALP®) technology represents a seminal breakthrough in the atomic layer deposition (ALD) arena. By ingeniously combining the meticulous precision of Temporal ALD (TALD) with the accelerated deposition rates characteristic of Spatial ALD (SALD), DALP® stands as a beacon of innovation, all while operating in ambient atmospheric conditions. This remarkable synthesis of speed and accuracy in DALP® is made possible through a distinctive microreactor design, which enables the direct application of precursor molecules onto the substrate, negating the need for vacuum environments that have long been a staple of ALD processes. GAS DEPOSITION: ATLANT 3D’s technology involves the sequential deposition of gasses for atomically precise patterning of various materials. So far we tested with our technology the following materials: TiO2, Pt, ZnO, SiO2. And it is continuously updated. MULTISTACK PRINTING: Our DALP™ technology allows to print conformally different materials, enabling: - High-quality multistack patterns and layers for complex devices - Cross-geometrical printing - Print resolution of 400 µm line width (25 µm in development) - Atomic monolayer (0.2 nm) vertical resolution COMPLEX SURFACES: Our technology allows unprecedented selective patterning on flat, corrugated and porous surfaces: - Nanostructure surfaces (nanopillar nanograss etc.) - Microfluidics channels and optical gratings - With surface roughness up to 20 μm* - Substrate materials can be adapted based upon customer requirements Line Width: 400 µm now, 25 µm in development, 1 µm long term goal Temperature: Operates in a temperature range from room temperature (RT) up to 300°C Process speed: Variable from 0.1 mm/s up to 100 mm/s (based on sample and process specifications) Versatile Materials Platform: Possible to process several materials sequentially out of 450+ ALD materials possible. Environment: Open atmospheric conditions or within controlled ambient environments Hybrid processing: Direct additive and subtractive processing Selective Area Deposition: Path-defined processing for targeted deposition of materials Surface geometry: Conformal deposition on any type of surface with corrugation up to 60 µm Multimaterial stack printing: Multiple materials can be deposited sequentially Crystalline Material: Growth High quality material deposition Selective nanoparticle deposition: Tested with platinum (Pt) processes Hollow microstructuring: Post process hollow structure development Direct Atomic Layer Processing (DALP®) is a revolutionary technology pioneered by ATLANT 3D, marking a significant leap in the field of nanofabrication. It utilizes a unique microfluidic chemical reactor for selective area direct atomic layer processing, distinguishing itself from traditional methods by offering maskless flexibility and rapid prototyping capabilities. Capable of handling over 450 materials, DALP® is applicable in diverse sectors including MEMS & Sensors, Photonics, and RF & Microelectronics. Key highlights of DALP® include its atomic-scale precision, multi-material deposition in a single process, and its adaptability to various substrate surfaces. This technology not only accelerates material innovation by facilitating rapid testing and development, but also integrates seamlessly into existing laboratory infrastructures. Additionally, DALP® supports environmental sustainability by minimizing waste and reducing reliance on harmful chemicals, making it a forward-thinking solution in advanced manufacturing. DALP® is scalable for industrial applications, affirming its suitability for both research and large-scale production needs. ATLANT 3D provides extensive support for DALP® users, including technical assistance, training, and integration consultation, ensuring the effective application of this groundbreaking technology across various industries and research domains.
