In Singapore, our advanced packaging R&D center of excellence – opened in partnership with Agency for Science, Technology and Research (A*STAR), Singapore’s leading public sector research and development agency – is focused on next-generation photonics and developing capability in chip-stacking and wafer bonding technologies. Our solutions in Singapore are manufactured on our 200mm silicon photonics platform, with plans to scale to 300mm. The expanded technology portfolio, production capacity and R&D from the Singapore site complements our U.S. capabilities.
