applied microSWISS is offering a resist coating service to its customer. Lithographic processes begin with a perfectly coated photoresist. Coating uniformity and proper softbake are essential. We have extensive knowledge in photoresist-processing and it starts with substrate preparation (e.g. cleaning, dehydration and adhesion promotor). We have identified our photoresist-processes as a very precious asset and constantly keep improving it. We also take great precaution on particle contamination and are well equipped and trained to deliver high-quality coated wafers, glass-plates and other customer substrates. Specifications: List standard available photoresists: Various positive-tone Merck AZ resists for the full range of thicknesses. Megaposit SPR 220 series Kayaku (former: MicroChem) Photoexpoxy SU-8, KMPR Image reversal Lift-off (AZ nLOF 20xx, TI35 ES, TI35 ESX) Substrate formats: Round substrates: ø100, ø150, ø200, ø300mm Square substrates: 4", 5", 6", 7", 9" Available Resist thickness: Positive-tone resists: 100nm - 80µm (e.g. AZ resists) Negative-tone resists: 3µm - 550µm (e.g. SU-8) Process flexibility: Other resists, substrate formats or resist thicknesses on request. Manufacturing a batch of substrates with 15µm AZ 10XT: 1. Customer sends substrates in cleanroom-compatible container 2. Substrate inspection and preparation (cleaning + adhesion promotor) 3. Resist coating and softbake with superior uniformity 4. Packaging coated wafers in opaque container 5. Shipping with appropriate remarks for handling, care and storage Manufacturing a batch of substrates with 270µm SU-8 1. applied microSWISS to prepare substrates 2. Substrate inspection and preparation (cleaning + adhesion promotor) 3. Resist coating and softbake with superior uniformity 4. Packaging coated wafers in opaque wafer-box 5. Shipping with appropriate remarks for handling, care and storage Manufacturing a batch of QZ plates with 200nm AZ 1805 1. Customer sends substrates in cleanroom-compatible container 2. Substrate inspection and preparation (cleaning + adhesion promotor) 3. Resist coating and softbake with superior uniformity 4. Packaging coated wafers in opaque container 5. Shipping with appropriate remarks for handling, care and storage
