List standard available photoresists: Various positive-tone Merck AZ resists for the full range of thicknesses. Megaposit SPR 220 series Kayaku (former: MicroChem) Photoexpoxy SU-8, KMPR Image reversal Lift-off (AZ nLOF 20xx, TI35 ES, TI35 ESX) =» Choice of appropriate auxillery chemicals (e.g. Thinner, Developer, EBR, Remover) Substrate formats: Round substrates: ø100, ø150, ø200, ø300mm Square substrates: 4", 5", 6", 7", 9",10" Available Resist thickness: Positive-tone resists: 100nm - 80µm (e.g. AZ resists) Negative-tone resists: 3µm - 550µm (e.g. SU-8) Pattern resolution and innovation: Minimal lateral feature size = 2µm Overlay acccuracy depending on resist-thickness. @ Thin resist: 1-1.5µm Aspect ratio = 5 - 6 (AR: pattern height / smallest footprint feature) Our speciality: modifiying pattern to become transferred into resist optimal Process flexibility: Other resists, substrate formats or resist thicknesses on request. Patterning a batch of substrates based on customer data: 1. Customer sends pattern-design (CAD-file, sketch,...) 2. applied microSWISS takes care of maskset-manufacturing 3. applied microSWISS to order appropriate substrates 4. Inspection and preparation of substrates (cleaning + adhesion promotor) 5. Resist coating and softbake with superior uniformity 6. UV-exposure, development and inspection of pattern 7. Packaging processed wafers in opaque container 8. Shipping with appropriate remarks for handling, care and storage
