By Engent, Inc
Wafer processing is an important aspect of providing the capability to offer microelectronics assembly services. In order to provide die assembly, the die must be prepared in a format that is compatible to either wire bond or flip chip assembly. Preparation of the die includes the following items: - Wafer saw, sort, and inspect - Wafer Thinning - Wafer Bumping - Die Banking - Known Good Die - Tested at Speed Burn In
