In the laser release system, the device wafer is bonded to a transparent glass carrier using a bonding material and a release material. Once processing is completed, the pair is separated by exposing the release material with a laser source. Low-stress separation coupled with high throughput make the laser release system suitable for all production environments. Bonding Material: WaferBOND® HT-10.11material or BrewerBOND® 305 material Release Layer: BrewerBOND® 701 material BrewerBOND® VersaLayer System: BrewerBOND® C1300 series materials with BrewerBOND® T1100 series materials Max Throughput: 50 WPH Thermal Stability: ≤ 400°C LOWEST STRESS
