In the photonic debonding system, a pulsed broadband light source is used to debond temporarily bonded wafer pairs by using an inorganic metal light absorbing layer as a release layer. Photonic debonding is compatible with thinned device wafers less than 20 µm. This method is often desirable for bonded pairs that may have some slight bow/warp because its high tolerance for variations in focal distance to the release layer enables suitable debonding performance. Bonding Material: BrewerBOND® 305, BrewerBOND® 230, or WaferBOND® HT-10.11 materials Release Layer: LAL (light absorber layer); not a Brewer Science material but an inorganic layer deposited on the carrier substrate Max Throughput: 50+ WPH Thermal Stability: ≤ 280°C LOWEST STRESS
