By Asia Pacific Microsystems Inc.
Wafer Bonding - Fusion bonding with or without cavities Si substrate. - Au/Sn eutectic bonding with forming gas - Anodic bond for silicon or SOI on glass wafers - Adhesive bond - Bond alignment accuracy ± 5µm - Bonding in a controlled environment. - Pressure range: 10-3 mbar in vacuum ~ 2 bar in over pressure - With heater and contact force capability (Max. 40KN)
