Built on ultra-low-power CMOS, RF, silicon photonics, advanced packaging, embedded non-volatile memory and now MIPS and ARC real-time RISC-V processors, GF delivers an end-to-end platform for intelligent autonomous systems backed by a resilient global manufacturing footprint across the U.S., Europe and Asia. As intelligence moves into devices, vehicles and robots, GF delivers the semiconductor technologies that power this new era of real-world, real-time computing. Physical AI systems demand four capabilities that must work together at the system level: precision sensing, ultra‑low‑power compute, deterministic actuation and secure low‑latency connectivity. GF is the only manufacturing partner that brings all four capabilities together under one roof. Ultra-low-power compute: Long battery life, low leakage and the right PPA for real‑time edge workloads; reliability even in harsh environments RF & connectivity: RF-SOI and SiGe to move sensor data and decisions reliably across domains and networks with low latency Deterministic, real-time processing: Safety‑capable, low‑latency, RISC‑V‑based compute subsystems paired with GF’s processes and global manufacturing to get to working silicon faster Advanced packaging & silicon photonics: High‑bandwidth, heterogeneous integration that brings sensing, compute, memory and I/O closer together, cutting latency and power Embedded memory: Fast, power‑efficient non‑volatile memory that keeps models and data local to the edge and future‑proofs designs Manufacturing at scale: A trusted, expanding footprint to deliver volume resilience and state‑of‑the‑art advanced packaging for the AI era
