By Engent, Inc
Chip on board (COB) assembly or packaging is a semiconductor assembly technology meant to eliminate conventional device packaging. Assembly directly mounts the microchip or die, connecting it to the circuit board with die-attach adhesive and curing with heat or ultra-violet light. Our expert engineers then complete the wirebonding process to protect against chemical and mechanical damage. - Reduced space requirements - Reduced cost - Simplified manufacturing - Increased performance - Better protection against reverse-engineering
