By Engent, Inc
Engent also offers several other circuit board and advanced SMT assembly services, including: - Flip chip assembly - 01005, 0201 through 55 mm BGA processing - Advanced area array packages (FPBGA, CCGA, HBGA, Double Sided BGA, Mirror BGA) - Chip scale package (CSP) assembly - 0.3mm – 0.5mm wafer scale CSP (WLCSP) assembly - Lead-free solder - Optoelectronics assembly - Fiber splicing - High-density large panel assembly
