Our SCALE ™ CPO solution is the industry’s first OCI MSA‑capable platform, exceeding requirements for the interconnect specification for modern AI scale‑up architectures. Built on advanced silicon photonics, this future-proofed solution combines integrated photonic devices, CWDM and DWDM and advanced packaging to improve bandwidth density and system scalability – versus traditional copper – for next‑generation optical compute interconnects. Fiber attach & optical scalability: Broadband detachable fibers with flat insertion loss over the CWDM spectrum to future-proof scaling from 4λ in each direction to 8λ and beyond, while enabling serviceability and known-good-die testability for next-generation AI interconnects Photonic portfolio strength: Advanced portfolio of fully-qualified photonic devices, such as 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes Advanced packaging enablement: Support for TSVs for high-speed signaling, power delivery and copper pad pitches ranging from 110µm down to sub-45µm for 2.5/3D stacking from organic substrates to silicon interposers Electronic-photonic integration: Integrates electrical ICs on single-digit advanced nodes to optimize best-in-class compute and state-of-the-art optics without compromising performance
