The mechanical release system offers low-stress, room-temperature separation of processed wafer pairs. In this system, the bonding material is paired with a release material on the carrier wafer, making it possible to gently separate the wafers. Bonding Materials: WaferBOND® HT-10.11 material, BrewerBOND® 305 material Release Materials: BrewerBOND® 510 material or BrewerBOND® 530 material BrewerBOND® VersaLayer System: BrewerBOND® C1300 series materials with BrewerBOND® T1100 series materials Max Throughput: 20 WPH Thermal Stability: ≤ 400°C LOW STRESS
