Ideal for low-stress applications, the chemical release system involves bonding the device wafer to a perforated carrier for further processing. After processing is completed, the bonded pair is placed in a solvent bath for separation. Bonding Material: WaferBOND® HT-10.11 materials Max Throughput: 25 wafers per cycle* (Wafers are separated using a batch process) Thermal Stability: ≤ 220°C LOW STRESS
