Layout Guidelines Copper Bumps (Solder, Nickel, Gold or Indium Cap) 1 Bump Height Average 100 um (10 um to 250 um stacked available) 2 Bump Height Uniformity ±5% (in die); ±15% (in wafer); ±20% (wfr to wfr) 3 Bump Pitch 150 um Standard (Bump Height Dependence) 4 Bump Spacing 75 µm Minimum (Bump Height Dependence) 5 Bump to Passivation Overlap 8 µm Per Side Minimum (10 um preferred) 6 Pad to Bump Overlap 7 µm Per Side Minimum 7 Passivation Opening 5 µm Minimum (Bump size dependence) 8 Cap Height 2-50um (Before Reflow) 9 Passivation Angle of Slope > 60 Degrees 10 Passivation Type Nitride, OxyNitride, Polyimide 11 Passivation Height 0.5-1.8 um 12 Wafer Edge Exclusion Zone 3 mm 13 Mask Layout and Procurement Requires GDSII or ACAD, Stepping Distance Wafer Map Specifications Copper Bumps (Solder, Nickel, Gold or Indium Cap) 1 Bump Height Average 100 um (10 um to 250 um stacked available) 2 Copper Shear Strength Height >12 grams/mil2 3 Voids <10% of Solder Bump Volume, No Exposed Pad 4 Missing Bumps None Outside Exclusion Area
