Layout Guidelines Solder Bumps 1 Standard Bump Height 100 µm (Available: 15 – 150 µm) 2 Bump Height Uniformity ±5% (in die); ±15% (in wfr); ±20% (wfr to wfr) 3 Bump Pitch 150 µm Standard ( Fine Pitch Available =25 µm) Bump Height Dependence 4 Bump Spacing 75 µm Std. (Bump Size Dependence) 5 Bump to Passivation Overlap 8 µm Per Side Minimum (10 um preferred) 6 Edge of Bump to Aluminum 7 µm Per Side Minimum 7 Passivation Opening 20 µm (Bump size Dependence) 8 Passivation Angle of Slope > 60 Degrees 9 Passivation Type Nitride, OxyNitride, Polyimide 10 Wafer Edge Exclusion Zone 3 mm 11 Bump Mask Layout and Procurement TLMI In-House Capability: Requires GDSII, Stepping Distance, Wafer Map Bump Specifications Solder Bumps 1 Bump Material Sn/Pb any ratio, Low Alpha, Sn/Ag/Cu, Sn/Ag 2 Bumping Method Electroplating 3 UBM Material Ti/Cu, TiW/Cu, Ti/Cu/Ni, TiW/Cu/Ni, TiW/Au/Ni 4 UBM Deposition Method Sputtering, Sputtering/Plating 5 Bump Shear Strength > 1.1 gm/mil2 hi-lead, >2.2 gm/mil2 others
