Layout Guidelines Gold Bumps 1 Bump Height Average 18 µm & 25 µm std. (Capability: 2-50 µm) 2 Bump Height Uniformity±5% (in die); ±10% (in wfr); ±15% (wfr to wfr) 3 Bump Pitch 50 µm Minimum (bump size dependence) 4 Bump Spacing 18 µm Minimum (bump height dependence) 5 Bump to Passivation Overlap 7 µm Per Side Minimum 6 Edge of Bump to Aluminum 7 µm Per Side Minimum 7 Passivation Opening 16 µm Minimum 8 Passivation Angle of Slope> 60 Degrees 9 Passivation Type Nitride,OxyNitride, Polyimide 10 Passivation Thickness 0.8 – 1.8 um 11 Wafer Edge Exclusion 3 mm 12 Bump Mask Layout and Procurement TLMI In-house Capability: Requires GDSII, Stepping Distance, Wafer Map Bump Specifications Gold Bumps 1 Bump Material 99.9+% pure Gold 2 Bumping Method Electroplating 3 UBM Material WTi 90/10 4 UBM Deposition Method Sputtering 5 Bump Shear Strength> 5.6g/mil2 6 Bump Hardness 40 – 70 Vickers (Annealed)
